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The WACCO Standalone Wafer Edge Exposure is a system
to exposure wafer edge with UV light source in a
certain
recipe.
The SEEW 200 Increase process efficiency by removing photoresist
around a wafer. |
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¢Â Compact Footprint
¢Â High Reliable and Repeatable Positioning
¢Â High Accurate Removal of Photoresist from Wafer Periphery
¢Â Fast Wafer Centering and Flat/Notch Zone Aligning (Non- contact
type)
¢Â High Reliability and Repeatability Wafer Handling Dual Armed Robot
¢Â Perfect Wafer Mapping
¢Â 2Uni-Cassette Stage
¢Â Class 1 Clean Room Compatible
¢Â Fastest Cycle Time(High Throughput)
¢Â Easy to Use and Install |
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Item |
Specifications |
Dimension |
¡¡ 750(W)x1200(D)x1300(H) |
Wafer Size |
¡¡ 200mm |
Exposure Mode |
¡¡ Round, Linear |
Radiation Wavelength |
¡¡ 248, 365 mm |
Exposure Width |
¡¡ 0.5 ~ 10 mm |
Exposure Width Accuracy |
¡¡ ¡¾0.05mm |
Resist Slope |
¡¡ ¡Â 10¥ìm |
Irradiance |
¡¡ Max. 1500mW/§² |
Lamp's Guaranteed Life |
¡¡ 2000 hours |
Throughput |
¡¡ Round : 100 Wfs/Hr
¡¡ Round + Linear : 80 Wfs/Hr |
Aligning Accuracy |
¡¡ Centering : ¡¾ 0.05mm
¡¡ Angle : ¡¾ 0.05¢ª |
Utility Requirement |
¡¡ Power : 220VAC, 1¥õ , 30A, 50/60Hz
¡¡ Vacuum Pressure : ¡Ã 600 mmHg(80kPa)
¡¡ Exhaust : 5§©/min(Main), 1§©/min(Lamp Housing) |
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