The WACCO Standalone Wafer Edge Exposure is a system to exposure wafer edge with UV light source in a certain
recipe.

The SEEW 200 Increase process efficiency by removing photoresist around a wafer.
 
¢Â Compact Footprint
¢Â High Reliable and Repeatable Positioning
¢Â High Accurate Removal of Photoresist from Wafer Periphery
¢Â Fast Wafer Centering and Flat/Notch Zone Aligning (Non- contact type)
¢Â High Reliability and Repeatability Wafer Handling Dual Armed Robot
¢Â Perfect Wafer Mapping
¢Â 2Uni-Cassette Stage
¢Â Class 1 Clean Room Compatible
¢Â Fastest Cycle Time(High Throughput)
¢Â Easy to Use and Install
 
Item Specifications
Dimension ¡¡ 750(W)x1200(D)x1300(H)
Wafer Size ¡¡ 200mm
Exposure Mode ¡¡ Round, Linear
Radiation Wavelength ¡¡ 248, 365 mm
Exposure Width ¡¡ 0.5 ~ 10 mm
Exposure Width Accuracy ¡¡ ¡¾0.05mm
Resist Slope ¡¡ ¡Â 10¥ìm
Irradiance ¡¡ Max. 1500mW/§²
Lamp's Guaranteed Life ¡¡ 2000 hours
Throughput ¡¡ Round : 100 Wfs/Hr
¡¡ Round + Linear : 80 Wfs/Hr
Aligning Accuracy ¡¡ Centering : ¡¾ 0.05mm
¡¡ Angle : ¡¾ 0.05¢ª
Utility Requirement ¡¡ Power : 220VAC, 1¥õ , 30A, 50/60Hz
¡¡ Vacuum Pressure : ¡Ã 600 mmHg(80kPa)
¡¡ Exhaust : 5§©/min(Main), 1§©/min(Lamp Housing)